rdlc data matrix

rdlc data matrix

rdlc data matrix

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In some cases, it has been possible to replace the through-hole connector with one of a variety of solderless products Also, it is not necessarily size or weight that causes a component to be identified as oddform per the particular assembly line Temperature-sensitive and moisture-sensitive devices may also be excluded from a reflow step of the assembly process to prevent damage to them The latter scenario is of particular concern when converting from a Sn-Pb to a Pb-free process DCA refers to the assembly of an unpackaged active semiconductor device directly onto the circuit board The interconnections are made either by wirebonding or by solder bumps on the front side of the die The latter application is referred to as FC attachment and can be implemented into a surface-mount assembly process as long as existing equipment can accommodate the placement accuracy required for the very small solder bumps and pads.

'set up the LCD 'Go to 1st line 1st space 'Potentiometer position 'print pot value 'erase over old data 'Go to 1st line 1st space 'Potentiometer position 'print pot value 'erase over old data 'Read Pot routine 'Read Pot routine2

Otherwise, a dedicated cell may be required The DCA process, which uses wirebond interconnections, is based on the following steps First, an adhesive is dispensed on the board and the die placed on it The adhesive, which is often thermally conductive for heat management, is cured The I/O pads on the die are wirebonded to the appropriate pads on the circuit board Then, the die and wire bonds are encapsulated in an epoxy to prevent damage to them The encapsulant, or glob top, is then cured Critical to the glob top technology are the following factors: complete coverage of the die and wire bonds with minimal run-out beyond the circuit board pads; adequate adhesion between the die and circuit board; and good adhesion between the encapsulant and the circuit board beyond the perimeter of the die..

40.4.2 Manual Assembly In the least complicated format, only an operator places the odd-form components on the circuit board. The soldering process is automated in that the operator picks components from bulk bins and repeatedly positions them onto the circuit board as it is carried along the conveyor line. For paste-in-hole assembly, the solder paste and other components (surface-mount or through-hole) may already be on the board, being held in place only by the tackiness of the paste. Therefore, the operator must not inadvertently displace other components off of their sites during handling. Also, the operator must pay special attention to handling and ESD damage while placing components. Also, those components that incorporate snap-in features (e.g., connectors) can require that the operator exert relatively high forces on the circuit board. Thus, the operator must not damage either that component or other components and the circuit board. Often, special tooling is used to press snap-in components on the circuit board to prevent such damage. A large number of applications require the operator to place and then manually solder the odd-form component into place, often after the other components have been soldered into place.The operator must be cognizant of handling and ESD damage as well as prevent thermal damage or the inadvertent reflow of solder joints for neighboring components. The impact of

Pb-free soldering would be most significant in this circumstance. It is necessary to verify that a longer hand-soldering time or a higher tip temperature does not cause thermal damage to the component in question or cause the reflow of nearby solder joints. It should be noted that irrespective of whether manual assembly is performed on only stuffed boards that will be subsequently soldered or on circuit boards that have already been soldered, the units have a higher value to them because of this processing, which is performed beforehand. Therefore, any damage (handling, ESD, thermal, etc.) will result in a significantly higher yield loss to production volumes as well as higher costs associated with the repair or scrapping of damaged circuit boards. Therefore, manual assembly steps must be given due consideration during product design and process development activities.