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40.3.3.2.2 Fluxes. The dispensing of fluxes has more limited applications in surface-mount technology (aside from mixed technology that includes a wave-soldering step). Flux dispensing is performed when solder is not simultaneously delivered to the joint for example, the wave soldering of a mixed technology circuit board or the attachment of an area-array package for which the solder balls provide a sufficient quantity of alloy for the joint. In fact, flux dispensing is most widely used for DCA/FC applications. The DCA joints often require only a very small quantity of solder that would be difficult to control or to place accurately with typical printing equipment and stencils. Thus, the quantity of solder present in the ball forms the joint, and only flux must be added to the assembly. Soldering fluxes are generally available only as a liquid for electronics applications. The low viscosity prevents the flux from being precisely located on the circuit board using stencil printing. Therefore, flux is usually dispensed by spraying techniques. However, once flux is sprayed on the surface, the circuit board must be soldered very quickly as volatiles and other components begin to evaporate from the flux coating. In the case of DCA applications, the flux is applied directly to the component. The process is shown schematically in Fig. 40.14. The die is placed into a bath containing a very thin layer of flux. The thickness of the layer controls the quantity of flux taken by the die when it is withdrawn from the bath. The flux must be sufficiently tacky to anchor the die to the substrate for transport to the reflow step. Because of the large exposed surface area of the flux bath, the flux volatiles readily evaporate so that the bath must be replenished on a regular basis.

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FIGURE 40.14 Flux dispensed on the balls of a flip-chip component: (a, b) The solder balls are immersed into the flux reservoir; (c) the component is removed from the reservoir with the solder balls coated with flux; (d) the component is placed on the circuit board.

40.3.3.2.3 Solder Paste. The dispensing of solder paste is the most widely used means of providing flux and solder metal to the joint for the reflow process. The primary components of the solder paste are the solder metal and the flux. The solder metal is typically 80 90 wt. percent of the paste. Aside from the In- and Zn-containing solders, there is very little sensitivity of the paste properties to the solder metal composition for Sn-based alloys. Important properties of the paste with respect to dispensing are the solder powder particle size and weight percent or metal loading of the paste.

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The flux can be any one of the various compositions rosin-based, no-clean, low solids, and water-soluble. The flux also provides the tack that keeps the components attached to the board prior to the reflow step. Other ingredients in the paste are the thixotropic agents. It is the thixotropic agents, together with the metal content and flux, that determine the viscosity of the paste. Viscosity controls the dispensing properties of the paste, irrespective of the particular technique (needle, screen printing, etc.). The viscosity and hence the dispensability of the paste change with time, whether slowly in an unopened jar on the shelf or more quickly when the paste is exposed to air while awaiting the dispensing step. Care should be taken to monitor strictly the manufacturers recommendations for shelf-life and lifetime on the assembly floor. Poor solder paste dispensing accounts for the majority of solder-joint defects observed in surface-mount technology. 40.3.3.2.4 Dispensing Methods. There are five primary methods for dispensing adhesives, fluxes, and solder pastes: 1. 2. 3. 4. 5. Pin transfer Screen or stencil printing Time-pressure pump dispensing Archimedes screw pump dispensing Positive displacement pump dispensing

The latter three methods generally produce a single deposit per dispensing step. The first two methods enable the application of the material at multiple sites in a single step. Of course, the five techniques do not perform equally well for the three materials. This section discusses the advantages and disadvantages of each technique. Pin transfer is the simplest technique for dispensing adhesives and flux.Although a single pin may be used to deposit material one location at a time, a matrix of pins can do so at multiple sites, the pin transfer process is illustrated in Fig. 40.15. This technique is suitable for adhesives

FIGURE 40.15 Pin transfer technique: (a) The pin is brought down to the adhesive reservoir; (b) the pin is immersed in the adhesive; (c) the pin is withdrawn from the reservoir with a repeatable quantity of adhesive; (d) the pin is positioned on the circuit board, allowing the adhesive to contact the surface; (e) the pin is withdrawn from the surface, leaving behind a well-controlled volume of adhesive.

and fluxes; it does not work as well with solder paste A pin is dipped into a reservoir of the adhesive or flux The length and diameter of the pin determine the quantity of material that is picked up upon its withdrawal from the reservoir The pin is then lowered to a position just above the surface of the printed circuit board that allows the flux or adhesive to contact the circuit board Surface tension causes a portion of the adhesive or flux to be deposited on the printed circuit board It is very important that the pin does not touch the board because this will cause inconsistent dot sizes and shapes This system requires the substrate to be relatively flat and free from distortion.

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