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Assembly Processes The basic assembly process sequence for surface-mount technology is (1) solder paste printing, (2) pick and place of components, and (3) reflow of the solder. The assembly process is complicated when through-hole components are combined with surface-mount devices on the same circuit board; this is the previously mentioned mixed technology. In general, hand assembly of surface-mount boards is not always practical given the small size of passive devices and hidden solder joints of area-array packages. The use of hand soldering for repair and rework activities is limited by these same factors. This section lists the sequence of process steps for the different circuit board categories.The term top side has typically referred to the side with the greatest density of components and/or where the larger, active device packages are clustered together. As the functionality of printed circuit board products increases, these physical distinctions between the two sides have become less obvious. Therefore, the circuit board sides are simply given a designation: A or B.

ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY*

All electronic components must be interconnected and assembled to form a functional and operating system. The design and the manufacture of these interconnections have evolved into a separate discipline called electronic packaging. Since the early 1950s, the basic building block of electronic packaging is the printed wiring board (PWB), and it will remain that into the foreseeable future. This book outlines the basic design approaches and manufacturing processes needed to produce these PWBs. This chapter outlines the basic considerations, the main choices, and the potential tradeoffs that must be accounted for in the selection of the interconnection methods for electronic systems. Its main emphasis is on the analysis of potential effects that the selection of various printed wiring board types and design alternatives could have on the cost and performance of the complete electronic product.

Oftentimes it is necessary for the engineer to control a small fractional horsepower electrical motor as a part of his experimental apparatus. The easiest way to do this is to use a solid-state relay that will accept a TTL signal as its input and have the capacity to control the current and voltage needed by the motor. A number of vendors provide very easy-to-use, solid-state relays that meet these specifications, via the Internet. Figure 29-1 shows the relay manufactured by Crydom and available from Jameco.

2.2 MEASURING THE INTERCONNECTIVITY REVOLUTION (HDI)

The continuing increase in component performance and lead density, along with the reduction in package sizes, has required that PWB technology find corresponding ways to increase the interconnection density of the substrate. With the introduction and continued refinement of such packaging techniques as the ball grid array (BGA), chip-scale packaging (CSP), and chip-on-board (COB), traditional PWB technology has approached a point where alternative ways of providing high-density interconnection have had to be developed. (See Chaps. 3 and

* Adapted from Coombs, Clyde F. Jr., Printed Circuits Handbook (4th ed.), chap. 1, Electronic Packaging and Interconnectivity, (McGraw-Hill, New York, 1996.)

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4 for detailed discussions of component and packaging technologies.) This has been called at times high-density interconnects (HDI), the interconnection revolution, or the density revolution, because doing the same things in the same way, only smaller, was no longer sufficient.

Interconnect Density Elements The extent of these interconnect density issues is not always observable, but the chart1 in Fig. 2.1 can help one define and understand it. The chart portrays the interrelationship between component packaging, surface-mount technology (SMT) assembly, and PWB density. As can be seen, these three elements are interlinked. A change in one has a significant effect on the overall interconnection density. The metrics are as follows:

Figure 29-1 A solid-state relay (note the indicator LED)

Assembly (parts & leads per sq. inch)

Components (ave. leads per part)

PWB (inches per sq. inch)

FIGURE 2.1 Representation of the metrics of assembly, component, and PWB technologies and their general relationship to each other.

Assembly complexity: the measure of the difficulty of assembling surface-mounted components in parts per square inch and leads per square inch. Component packaging complexity: the degree of sophistication of a component, measured by its average leads (I/Os) per part. Printed wiring board density: the amount of wiring a PWB has as measured by the average length of traces per square inch or the area of that board, including all signal layers. The metric is inches per square inch.