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crystal reports pdf 417

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Program 28-15 Program in Which Motor Speed and Direction Follow an R/C Servo Signal (Remote Speed Control of a Motor) (continued)

FIGURE 40.2 Diagram showing placement of the soldering iron tip for heating the lead and placement of the solder wire to complete the joint.

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3. The solder wire is brought into contact at the side of the lead opposite to the soldering iron tip. The solder wire should not contact the tip in order to melt it. Once melting, the solder is allowed to wet and spread over the surfaces as well as to flow through the hole. In the case of flux-cored wire, the flux application step is omitted. A properly designed process that is, one having a soldering iron with adequate power as well as tip temperature and geometry should complete the joint in approximately 3 to 7 sec. 4. Once the soldering process is completed, the circuit board is cleaned of flux residues when required by the flux type or the product s long-term reliability requirements. Hand soldering may be achieved in an assembly (or slide ) line process for larger volumes. In this case, each one of several operators solders only a few of the total components of the circuit board. In the case of single-person work cells, the operator may solder all of the components to the circuit board. Alternatively, the work cell may be used to add odd-form components as the final assembly step on a nearly complete circuit board. 40.2.5 Automated Soldering and Insertion Technology In the case of automated assembly processes, the general sequence is part insertion followed by the soldering step. (Slightly different steps are used for the paste-in-hole process; that is, the paste may be applied before or after part insertion.) 40.2.5.1 1. 2. 3. 4. Components. Part insertion is typically performed in the following order:

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The following subsections provide a brief description of each of the component formats and the manner in which the insertion machine addresses those formats. Choosing the appropriate insertion machine depends on production volume requirements and the mix of products (part density, board sizes, etc.) that must be assembled in the factory. These factors determine the machine s physical dimensions, placement speed, and parthandling (staging) features. 40.2.5.1.1 Dual Inline Pin (DIP) Package. The first auto-insertion process is placement of the DIP packages.The typical DIP package (see Fig. 40.3) is manufactured in one of two widths: 7.6 mm and 15.2 mm. Package lengths vary with the number of pins. For example, a 6-pin DIP package can have the same width and length of 7.6 mm. On the other hand, a 42-pin DIP package has a width of 15.2 mm and a length of 54.6 mm. The DIP packages are typically received in 61 cm length plastic tubes.The insertion machine carries these tubes vertically in magazines.The part shuttle selects the appropriate package and carries it to the center of the machine for insertion into the circuit board.Tooling on the shuttle head holds the package by the leads during the insertion process. The tooling is simply scaled for different DIP package dimensions.

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FIGURE 40.3 Dual inline package (DIP). (Courtesy of Sandia National Laboratories.)

Dual inline packages are either molded plastic (PDIP) or ceramic (CerDIP, or just CDIP) The surface finishes on PDIP packages are typically electroplated layers of Ni (solderable layer) and Sn-Pb (protective finish) over a Cu lead frame The Sn-Pb finish is being replaced with 100 percent Sn layers to meet environmental requirements The CDIP package has low-expansion Fe-based alloy leads that are either electroplated with Cu finish for solderability or the alternative lead finish of Ni (the solderable layer) followed by Au (the protective layer)Although the DIP package is rarely received from the manufacturer with a hot-solder-dipped coatings, these coatings may be applied, after-market, to prevent Sn whiskers with 100 percent Sn finishes (PDIP) or Au embrittlement with Au finishes (CDIP).

Instead, you can use an expression to reference the accessor defined by the association between the OrderItems entity object, and the ProductInformation entity object. In this case, the accessor is called ProductInformation.

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