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Thickness has minimal direct impact on the ability of automated machines to accept a circuit board physically (The same is true of hand soldering) However, the board thickness affects the soldering process As thickness increases, it becomes more difficult to supply a sufficient amount of heat to the joint area that allows the molten solder to fill the through-hole completely prior to solidification Copper layers contained within the laminate, which are used for signal transmission, ground planes, radio frequency (RF) shielding, and power sources as well as layers for thermal management, act as additional heat sinks that can impede the flow of molten solder into the hole 40223 Pb-Free Solders Design rules and industry standards that have been established are based primarily on experiences with eutectic Sn-Pb solder Studies are investigating through-hole processes for Pb-free solders.

On the Customers entity object, add a new validation rule to DateOfBirth. Set Rule Type to Compare, Operator to LessThan, and Compare With to Expression. Enter adf.currentDate into Expression. The value adf.currentDate is a built-in Groovy expression that returns the current date.

Part insertion, equipment tooling considerations, even paste placement for paste-in-hole technology will be largely unaffected by the change of solder alloy As noted previously, in spite of the higher liquidus temperature, hand-soldering iron tips and wave-soldering pots will use similar temperatures The design engineer will have to address the generally poorer solderability of Pb-free alloys, which arises from the higher surface tension of the solder Flux selection and alternative surface finishes can mitigate this discrepancy to some degree Other measures may be necessary For example, the designer may be required to increase the spacing between components in order to avoid solder bridges that cause short circuits during wave and selective soldering The high Sn content of Pb-free solders results in a greater degree of erosion of the Cu features on the circuit board.

'wait for line 1 to go low. 'make sure that we see 'at full wave when we start measuring 'wait for line 1 to go low. Manual 'read the timer count 'wait for line 1 to go hi. See Manual 'read the timer count for second time 'wait for line 1 to go low. Manual. 'figure the pulse 'figure the cycle Len 'figure the freq

This phenomenon is particularly severe at the knee of the through hole when the molten solder is highly agitated such as in a wave-soldering or selective soldering machine Therefore, it may be necessary to reduce the time that the joint is exposed to the molten solder or to select an alternative Pb-free alloy (Sn-Ag-Ni or Sn-Ag-Ni-Ge) that is less prone to Cu erosion..

Assembly Process The through-hole printed circuit board can be a cost-effective technology for many applications. One determining factor is the level of automation used to make the product, which can range from hand assembly to fully automated processes (inline or batch). The specific assembly steps include component insertion (also referred to as board stuffing ), lead trimming, soldering, and post-assembly cleaning. Labor costs, capital expenditures, board design, and production volumes are contributing factors toward determining the details of these steps. There are two general formats for assembly processes: the cell or batch process and the line process. Both methods are discussed in the following subsections. 40.2.3.1 Cell (Batch) Process. The cell process routes the circuit boards in batches between the different steps. The cells or workstations are not always in immediate proximity to each another and can be entirely manual, semiautomated, or fully automated in terms of the actual process step. For example, component placement may be fully automated, but require several machines for inserting the different component types. Circuit boards are typically loaded and unloaded by hand between machines. Table 40.1 lists the advantages and disadvantages of the cell process. The cell or batch process is best suited for a facility that assembles a high mix of low production volume products (e.g., prototype development or high-reliability circuit boards) where flexibility is necessary on the factory floor.

TABLE 40.1 Advantages and Disadvantages of the Cell Process Advantages Single machine outage does not immediately stop the entire process line. Adds greater flexibility to the process by creating alternative workflow routes. Attractive for high-mix, low volume applications that require frequent equipment change-outs and re-tooling. Disadvantages Higher product flow time due to the transfer of parts between cells is unattractive for high volume applications. Part transfer between cells increases the likelihood of handling damage Difficult to predict product line throughput in a multi-cell assembly process.