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Through-hole technology refers to assemblies having components with leads that are inserted into holes in the circuit board and soldered into place.This technology has been used since the early days of electronics (the 1920s). The leap in automation came in the early 1960s with the advent of wave soldering. The particular drawback of through-hole printed circuit boards, which led to the introduction of surface-mount technology (see the next subsection), was low assembly densities. The relatively large devices, and the circuit board real estate required for holes, limited the density of components, which in turn restricted product functionality and further miniaturization. A photograph of a through-hole circuit board is shown in Fig. 40.1 along with an optical micrograph that shows the through-hole solder joint of the component lead extending through the circuit board. An advantage of through-hole technology is reduced cost in some applications. That cost benefit may be realized by lower labor costs in some parts of the world that support hand assembly, which is relatively easy with the larger components and products, and lower board densities. Even when fully automated either by wave soldering, selective soldering, or pastein-hole/reflow the capital equipment and manufacturing costs can still be lower than those required for surface-mount assembly.

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BIRT Barcode Plugin for eclipse BIRT versions 2.x, 3.x and 4.x
BIRT, Barcode, Barcodes, Plugin, QRCode, QR Code, EAN, UPC, EAN13, EAN128, EAN8, UPCA, UPCE, TM3 Software.

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BIRT Barcode Plugin for eclipse BIRT versions 2.x, 3.x and 4.x ...
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FIGURE 40.1 (a) Photograph of a through-hole printed circuit board. (b) Optical micrograph of the component lead as it is soldered into the circuit board hole. (Courtesy of Sandia National Laboratories.)

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UPC-A Java Control-UPC-A barcode generator with free Java sample
UPC-A barcode generator for Java is a very professional barcode generator, creating high quality UPC-A barcodes in Java class, iReport and BIRT. Download​ ...

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Java UPC-A Barcodes Generator Guide. UPC-A Bar Code Generation Guide in Java class, J2EE, Jasper Reports, iReport & Eclipse BIRT. Easily generate ...

Impact of Pb-Free Soldering on Through-Hole Technology The change to Pb-free solders affects through-hole assembly technology First, there is equipment selection Manual assembly operations may require purchasing higher-temperature soldering irons At the other end of the cost spectrum, there are the expenses to replace several hundreds of pounds of Sn-Pb solder with a Pb-free alternative in the pot of a wave-soldering machine Alternatively, it may be advantageous simply to purchase an entirely new machine to avoid cross-contamination with legacy Sn-Pb operations and/or to have the latest technology that mitigates the higher erosion activity of Pb-free solders on machine components The use of Pb-free solders also requires a review of the process parameters The specific aspects are the higher processing temperature required to use Pb-free alloys and the reduced solderability of these alloys.

9:

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Help Java developers generate UPC A (or GTIN-12, UCC-12) barcodes in ... Create Eclipse BIRT report with UPC-A image using Java barcode generator ...

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It has been fortuitous that Pb-free solders, when used in manual (soldering iron) and wave processes, have not required a very significant increase in soldering iron temperature as was first anticipated in the early stages of Pb-free technology development The added temperature margin was of least concern with manual soldering processes because the localized heating limits thermal degradation to either the component or substrate Some concern arose in the wave-soldering process because the substrate is exposed to the molten solder bath On the other hand, paste-in-hole technology that uses a Pb-free reflow process subjects through-hole components and substrates to temperatures higher than those to which they are normally accustomed, thereby possibly degrading them The soldering of a through-hole interconnection is also susceptible to the intrinsically poorer solderability of Pb-free alloys.

The higher surface tension of these solders results in a slower flow of molten alloy between the pin and barrel, thereby potentially requiring a longer soldering time Also, the poorer solderability can result in reduced wetting of the pad and limited fillet formation, particularly on the opposite side of the circuit board to which the joint is being soldered Some of these solderability issues can be mitigated by changing flux and/or the use of alternative surface finishes (eg, Au solderable finishes) Both options can reduce the solder surface tension as well as enhance the base material metallurgical reaction, thereby improving solderability..

Design Considerations The design of a through-hole printed circuit board must necessarily consider currently available equipment and assembly practices as well as the potential for advances in future machines and processes. It is important that circuit board designs comply, as much as possible, with recommendations provided by industry standards, such as those of the IPC Association

repeat while ina[RadioIn]==0 startCycle:=CNT repeat while ina[RadioIn]==1 endPulse:=CNT repeat while ina[RadioIn]==0 endCycle:=cnt

Connecting Electronics Industries (IPC) and the Joint Electron Device Engineering Council (JEDEC).These recommendations include hole diameters, trace dimensions, and feature spacing. The overriding document is the specific product drawing. Any design deviations from industry standards must be fully considered with regard to how such changes will affect the assembly (process). The following are important design considerations regarding the assembly process for a through-hole printed circuit board products:

Tooling requirements (holes, edge clearances, etc.) Registration holes (manual alignments or vision systems) Component lead-hole sizes Circuit board dimensions (length, width, and thickness) Size and density of components Pb-free solders

Three of these factors are discussed below because of their general role on all assembly processes 40221 Component Lead and Circuit Board Hole Sizes Designing the correct component lead hole diameters begins by referring to the appropriated industry standard(s) (eg, IPC, Electronic Industry Association [EIA], etc) Hole tolerances must take into account runout by the drill, etch-back, barrel-plating thicknesses, and the need for a nominal gap of 007 to 015 mm between the pin and hole to support the capillary flow of the molten solder In addition, there are added tolerance considerations due to the variation in component lead diameters as well as the positioning accuracy of the equipment 40222 Circuit Board Dimensions (Thickness) The thickness of the circuit board is typically governed by the product design and the number of layers required for signal routing.

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Barcode – easily integrated and directly from BIRT | TRADUI
Extend your BIRT reports and forms with our Barcode Plugin with a number of machine-readable codes (e.g. EAN-128, QR-Code...).

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how to make UPC-A Barcode image in BIRT - TarCode.com
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