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40.1.1 Feature Density Product designers have been able to explore new packages, materials, etc., so as to increase functionality further while, at the same time, reducing the size and weight of both consumer as well as high-reliability military and space electronics.The result has been greater challenges for process engineers. For example, there is a continued trend of decreasing component sizes. Leadless ceramic chip capacitors having sizes of 0804, 0603, and 0402 are commonplace, whereas smaller 0201 devices are being introduced into product lines, particularly handheld products. Manufacturing resources are now developing the means to tool up for 01005-size components. Fine-pitch and area-array packages ball grid array (BGA), chip-scale packages (CSP), and flip-chip (FC) or direct-chip attach (DCA) provide the means to increase device functionality significantly. Input/output (I/O) interconnections that are reaching several thousands on BGA packages require stringent solder paste printing, part placement, and reflow processes controls to minimize defects. At the same time, the need for more complex, multilayer substrates has also placed limitations on the process window so as to avoid damage to circuit board microvias and fine traces that are needed to support higher assembly densities. Lastly, these challenges are made more complicated by the use of Pb-free solders. Changing equipment parameters as well as alternative surface finishes impact solderability performance and thus process yields as well.

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40.1.2 Printed Circuit Board Assembly Process There are two basic steps in the assembly of a printed circuit board: (a) placement of the components (resistors, capacitors, etc.) on the substrate and (b) soldering those components into place.Although this is a fairly accurate description of a through-hole, hand-soldering operation,

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nearly all electronics assembly operations are, in fact, considerably more complex. Multiple-step assembly processes provide the versatility to incorporate different component package types and a wide variety of substrate configurations and materials as well as to accommodate frequently changing production volumes in order to meet prescribed defect levels and reliability requirements. A more accurate, albeit still relatively general, listing of assembly process steps consists of the following: 1. 2. 3. 4. 5. Preparation of the component and substrate surfaces to be soldered Application of the flux and solder Melting of the solder to complete the joint Post-process cleaning of the soldered assembly Inspection and testing

Some of these steps may be either combined together or eliminated, depending on the particular product line. It is important that the manufacturing engineer and operator understand the critical steps in the printed circuit board assembly process to ensure the manufacture of a cost-competitive, reliable product. That understanding includes both the general function of the equipment as well as the activity taking place inside the machines. The following sections of this chapter describe in detail the printed circuit board assembly processes.

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How it returns is determined by the sophistication of the control algorithm, the ideal being a smooth and rapid return to the zero position without overshoot (this is referred to as perfect damping ) If the gain is too high and too much power is applied, the motor will start to oscillate wildly around the zero position If not enough power is applied, the motor will not get to the zero position rapidly enough or will not get there at all if the overall system friction is high In a sophisticated control scheme, the power to return to zero would be a function of how far from the zero position the motor was It might be changed in real time to reflect the load on the motor and any number of other factors.

Assembly Process Categories Assembly processes can be placed into the following three categories, which are described by the types of circuit board components:

The term Groovy has appeared a number of times in the book so far. So, what is Groovy Well, Groovy is a Java-like scripting notation that runs inside a JVM and has access to all the Java APIs, any custom classes and methods you write, as well as a few APIs of its own. Also, because it is interpreted at runtime, rather than being compiled, it can be customized on an application-to-application basis. But hold on, aren t we supposed to be coding in Java Yes, you are and yes, you will be. Nevertheless, ADF Business Components has a number of hooks into which you add Groovy expressions that give you the flexibility to write code without dropping into full-blown Java. This works particularly well with numerous features of ADF Business Components, including validation and default values where Groovy expressions can be used to provide conditional processing or values derived from expressions. For more information, search online for the Oracle White Paper Introduction to Groovy Support in JDeveloper and Oracle ADF 11g written by Grant Ronald.

Through-hole technology Surface-mount technology Mixed technology, which is a combination of through-hole and surface-mount components on the same circuit board